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  • DSP-系列薄膜分切机.jpg

Keywords:

Film Equipment

DSP-series film slitting machine

Category:

DSP-Series Slitting-Rewinder

Basic parameters

Substrate:

PI films.etc.


Substrate Width:

500 mm - 1500 mm


Substrate Thickness:

6.0μm-30μm

Speed:

max.300m/min


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